Apple’s new M1 Ultra chipsuse advances in a kind of chipmaking called “packaging.”
The process is part of a growing revolution in chip packaging.
The new chip is also more efficient than its competitors, claims Apple.
Apple
Power in Numbers
Apple isnt the only company exploring new ways to package chips.
AMDrevealed at Computex 2021a packaging technology that stacks small chips on top of each other, called 3D packaging.
The first chips using the technology will bethe Ryzen 7 5800X3D gaming PC chips expected later this year.
Apple
One area seeing progress is printed circuit boards (PCBs), Veres said.
This approach can reduce system size, increase performance, handle large thermal loads, and reduce costs.
SCHOTT sells materials that allow the manufacture of glass circuit boards.
